Electronics Enclosure
PLA, 0.2mm, snap-fit lid for quick iteration.
Prototypesenclosure
PLA, 0.2mm, snap-fit lid for quick iteration.
PA12 for durability and heat resistance.
Flexible damping with gyroid infill.
High detail, 0.05mm layer height.
Dimensional accuracy for assembly.
Material and color validation set.
Optical clarity with post-polish.
Sealing ring with shore 95A TPU.
PETG fixture for repeatable alignment.
Ergonomics evaluation model.
Precision resin application.
Heat-resistant cover with inserts.
Shock isolation component.